The key element and most complex process step in every multilayer interconnect technology is the via - an electrical connection between two adjacent metal layers separated by a dielectric material.

In the conventional technologies a dielectric sheet is used as base material, in which the vias are formed using drilling (etching or punching) and holeplating process.

ISM ALOXTM process is much simpler and do not require drilling and hole plating.

The starting material in the ISM process is a conductive aluminum sheet.

The first step in the process is masking the top and bottom of the sheet using conventional lithography techniques.

The vias are formed using anodization of the sheet through the whole thickness of the sheet.

The exposed areas are converted into aluminum oxide which is ceramic in nature and a highly insuling dielectric material.

The protected unexposed areas remain as aluminum elements-the connecting vias.

Using this innovative process a multilayer low cost ceramic board is formed.

The complete three metal layer core contains an internal aluminum layer, top and bottom copper layers with through vias and blind vias incorporated in the structure.

The technology is of best qualities - a very simple and low cost production process; excellent thermal performance product, superior mechanical and electrical properties.